Solder Paste
Tin Lead Solder Paste
Pishrokhotoot Co.,Ltd is Distributor of SHENMAO Solder paste.
San Lian Lee is the founder, Chairman, and CEO of SHENMAO Technology Inc. With over 30 years of experience in solder material industry. SHENMAO Technology has successfully supplied electronics assembly materials, such as solder pastes, BGA Sphere, solder wire, bar solder, flux and Pb-Free solder alloys to worldwide electronic industries.In order to train the excellent soldering material development personnel, our company established our own micro material institute. The main purpose of the institute is to study and focus on the Micro Lead-free soldering material. We aim for high quality and environmental friendly products since it is the trend in the world.
While setting the study of world class solder joint material as our primary research target, we have always insisted the whole participation process that involves every staff from the research, manufacture and the sales departments. Customer satisfaction and sustainable high quality have always been important to our company. The principles of SHENMAO are sincere, dependable, and creative and they will always be how we operate our business. And this is how SHENMAO has become the most valuable global Solder material provider.
Click Part No. for Download Data Sheet
- Alloy: Sn63/Pb37
- Flux Code: 09
- Melting Point(ªC): 183
- Flux Type: ROL0
- Halide Content(wt%): 0
- Particle Size (µm): 20-45
- Recommended for fine pitch 0.4mm print applications.
- Alloy: Sn62/Pb36/Ag2
- Flux Code: 09
- Melting Point(ªC): 179
- Flux Type: ROL0
- Halide Content(wt%): 0
- Particle Size (µm): 20-45
- Recommended for fine pitch 0.4mm print applications.
- Alloy: Sn62.8/Pb36.8/Ag0.4
- Flux Code: 09
- Melting Point(ªC): 179
- Flux Type: ROL0
- Halide Content(wt%): 0
- Particle Size (µm): 20-45
- Recommended for fine pitch 0.4mm print applications.
- Alloy: Sn63/Pb37
- Flux Code: 11
- Melting Point(ªC): 183
- Flux Type: ROL1
- Halide Content(wt%): 0.1
- Particle Size (µm): 20-45
- High activity.
- Alloy: Sn63/Pb37
- Flux Code: 20
- Melting Point(ªC): 183
- Flux Type: ROL1
- Halide Content(wt%): 0.1
- Particle Size (µm): 45-75 & 20-45
- Recommended for heat-sink applications.
- Alloy: Sn63/Pb37
- Flux Code: 90
- Melting Point(ªC): 183
- Flux Type: ROL1 Halide Content(wt%): 0.05Particle Size (µm): 15-30Recommended for Flip Chip applications.
- Alloy: Sn10/Pb88/Ag2
- Flux Code: N/E
- Melting Point(ªC): 2698-290
- Flux Type: ROL1 Halide Content(wt%): 0.05Particle Size (µm): 20-45Recommended for high temperature applications.
Competitive Price
Fast Delivery
Price: 110USD/Kg
Delivery:Iran/At Factory
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